Manufacturing Process Capabilities

Manufacturing Process Capabilities

PCB stack-up 1-20 Layer
Max. board thickness 125.98mil (3.20mm)
Min. board thickness (ML) 12 mil (0.3mm)
Min. board thickness (DL) 8mil (0.2mm)
Min. Inner layer thickness 2mil
Max. WPNL Size 550mmX 450mm
Inner layer copper thickness 0.3 oz~5.0 oz
Outer layer copper thickness 0.3 oz~4.0oz
Minimum drill hole size 6mil (0.15mm)
Max. width rate 1:8
Thickness error control ± 10%
Circuit width / spacing in outer layer 3/3 mil
Circuit width / spacing in inner layer 3/3 mil
Pitch limited SMT spacing 8mil (0.2 mm)
Pitch limited BGA spacing 6 mil (0.15 mm)
Limited solder mask print width 3 mil (0.075 mm)
Solder positioning and accuracy control ± 2 mil
Impedance control Ω ± 10%
Layer registration tolerance control ± 6mil (0.15mm)
Board warpage control ± 0.7%
Pattern to Board edge
(T<= 1.6mm)
CNC 6mil
V-Cut 15mil
湖北福彩3d走势图分析